- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
Patent holdings for IPC class H01L 23/532
Total number of patents in this class: 7535
10-year publication summary
|
659
|
862
|
920
|
938
|
919
|
899
|
763
|
730
|
723
|
180
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
1708 |
| International Business Machines Corporation | 60644 |
589 |
| Samsung Electronics Co., Ltd. | 131630 |
510 |
| Intel Corporation | 45621 |
347 |
| Micron Technology, Inc. | 24960 |
251 |
| GLOBALFOUNDRIES U.S. Inc. | 6459 |
213 |
| Nanya Technology Corporation | 2000 |
182 |
| Kioxia Corporation | 9847 |
163 |
| Applied Materials, Inc. | 16587 |
154 |
| United Microelectronics Corp. | 3921 |
122 |
| Renesas Electronics Corporation | 6305 |
117 |
| Tokyo Electron Limited | 11599 |
113 |
| Texas Instruments Incorporated | 19376 |
111 |
| Sandisk Technologies LLC | 5684 |
98 |
| Infineon Technologies AG | 8189 |
96 |
| SK Hynix Inc. | 11030 |
95 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1764 |
81 |
| Rohm Co., Ltd. | 5843 |
71 |
| Qualcomm Incorporated | 76576 |
67 |
| Tessera LLC | 246 |
64 |
| Other owners | 2383 |